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HCTS374K Datasheet(PDF) 10 Page - Intersil Corporation |
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HCTS374K Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 11 page 659 HCTS374MS Die Characteristics DIE DIMENSIONS: 108 x 106 mils METALLIZATION: Type: AlSi Metal Thickness: 11k Å ± 1kÅ GLASSIVATION: Type: SiO2 Thickness: 13k Å ± 2.6kÅ WORST CASE CURRENT DENSITY: 2.0 x 105A/cm2 BOND PAD SIZE: 100 µm x 100µm 4 mils x 4 mils Metallization Mask Layout HCTS374MS NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask series for the HCTS374 is TA14404A. OE (1) Q0 (2) D1 (4) Q1 (5) Q2 (6) D2 (7) GND (10) CP (11) Q4 (12) (15) Q5 (16) Q6 (17) D6 (18) D7 Q7 (19) VCC (20) (14) D5 D0 (3) D3 (8) Q3 (9) D4 (13) Spec Number 518635 |
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