HCTS574MS datasheet(10/11 Pages) INTERSIL

Part #	HCTS574MS

Description	Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered

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Manufacturer	INTERSIL [Intersil Corporation]

Direct Link	http://www.intersil.com/cda/home

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703

HCTS574MS

Die Characteristics

DIE DIMENSIONS:

101 x 85 mils

METALLIZATION:

Type: SiAl

Metal Thickness: 11k

Å

± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å

± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS574MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS574 is TA14460A.

OE

(1)

D0

(2)

D1 (3)

D2 (4)

D4 (6)

D6 (8)

D7

(9)

GND

(10)

Q7

(12)

(14) Q5

(16) Q3

(17) Q2

(18) Q1

Q0

(19)

VCC

(20)

(13) Q6

(15) Q4

CP

(11)

D5 (7)

D3 (5)

Spec Number

518629

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Manufacturer	Part #	Datasheet	Description
Renesas Technology Corp	HCTS574MS	430Kb / 10P	Radiation Hardened Octal D-Type Flip-Flop, Three-State, Positive Edge Triggered August 1995

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HCTS574MS Datasheet(PDF) 10 Page - Intersil Corporation

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