HCTS93D datasheet(9/9 Pages) INTERSIL

Part #	HCTS93D

Description	Radiation Hardened 4-Bit Binary Ripple Counter

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Manufacturer	INTERSIL [Intersil Corporation]

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488

HCTS93MS

Die Characteristics

DIE DIMENSIONS:

89 x 88 mils

2.25mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11k

Å

± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13k

Å

± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100

µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS93MS

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS93 is TA14454A.

CP1

(1)

MR1

(2)

MR2 (3)

NC (4)

VCC (5)

(6)

(7)

(8)

Q2

(9) Q1

(10) GND

(11) Q3

(12) Q0

(13) NC

CP0

NC

(14)

Spec Number

518622

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HCTS93D Datasheet(PDF) 9 Page - Intersil Corporation

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