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HFA1145 Datasheet(PDF) 5 Page - Intersil Corporation

Part No. HFA1145
Description  High Speed, Low Power, Current Feedback Video Operational Amplifier with Output Disable
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Maker  INTERSIL [Intersil Corporation]
Homepage  http://www.intersil.com/cda/home
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3-218
HFA1145/883
Die Characteristics
DIE DIMENSIONS:
59 x 58.2 x 19 mils
± 1 mils
1500 x 1480 x 483
µm ± 25.4µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Type: Metal 2: AICu(2%)
Thickness: Metal 1: 8k
Å
± 0.4kÅ
Thickness: Metal 2: 16k
Å
± 0.8kÅ
GLASSIVATION:
Type: Nitride
Thickness: 4k
Å
± 0.5kÅ
SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-)
WORST CASE CURRENT DENSITY: TBD
TRANSISTOR COUNT: 75
Metallization Mask Layout
HFA1145/883
V-
OPTIONAL
OUT
+IN
-IN
V+
GND (NOTE)
NOTE: This pad is not bonded out on packaged units. Die users may set a GND reference, via this pad, to ensure the TTL compatibility
of the DIS input when using asymmetrical supplies (e.g. V+ = 10V, V- = 0V).
Spec Number
511116-883
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com




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