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HFA1150IB96 Datasheet(PDF) 11 Page - Intersil Corporation |
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HFA1150IB96 Datasheet(HTML) 11 Page - Intersil Corporation |
11 / 13 page 11 Die Characteristics DIE DIMENSIONS: 53 mils x 25mils 1350 µm x 630µm METALLIZATION: Type: Metal 1: AlCu (2%)/TiW Thickness: Metal 1: 8k Å ±0.4kÅ Type: Metal 2: AlCu (2%) Thickness: Metal 2: 16k Å ±0.8kÅ PASSIVATION: Type: Nitride Thickness: 4k Å ±0.5kÅ TRANSISTOR COUNT: 40 SUBSTRATE POTENTIAL (POWERED UP): Floating (Recommend Connection to V-) Metallization Mask Layout HFA1150 OUT V+ V- +IN -IN HFA1150 |
Similar Part No. - HFA1150IB96 |
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Similar Description - HFA1150IB96 |
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