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Die Characteristics

DIE DIMENSIONS:

69 mils x 92 mils x 19 mils

1750

µm x 2330µm x 483µm

METALLIZATION:

Type: Metal 1: AICu(2%)/TiW

Thickness: Metal 1: 8k

Å

Type: Metal 2: AICu(2%)

Thickness: Metal 2: 16k

Å

SUBSTRATE POTENTIAL (Powered Up):

Floating (Recommend Connection to V-)

PASSIVATION:

Type: Nitride

Thickness: 4k

Å

TRANSISTOR COUNT:

180

Metallization Mask Layout

HFA1205

NC

+IN1

-IN1

V+

OUT1

NC

-IN2

OUT2

NC

NC

+IN2

NC

NC

V-

HFA1205