10

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to prevent an increase in ground impedance (which can cause

undesired oscillation).

(3) Keep the wiring length of the ground pins as short as possible.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions.

Other soldering methods and

conditions than the recommended conditions are to be consulted with our sales representatives.

PPC2726T

Soldering process

Soldering conditions

Recommended condition

symbols

Infrared ray reflow

Package peak temperature: 235 °C,

Hour: within 30 s. (more than 210 °C),

Time: 3 times, Limited days; no.*

IR35-00-3

VPS

Package peak temperature: 215 °C,

Hour: within 40 s. (more than 200 °C),

Time: 3 times, Limited days: no.*

VP15-00-3

Wave soldering

Soldering tub temperature: less than 260 °C,

Hour: within 10 s.

Time: 1 time, Limited days: no.

WS60-00-1

Pin part heating

Pin area temperature: less than 300 °C,

Hour: within 3 s.

Limited days: no.*

*: It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH.

Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).