Electronic Components Datasheet Search |
|
HIP6019CB Datasheet(PDF) 10 Page - Intersil Corporation |
|
HIP6019CB Datasheet(HTML) 10 Page - Intersil Corporation |
10 / 15 page 2-261 Layout Considerations MOSFETs switch very fast and efficiently. The speed with which the current transitions from one device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements. The voltage spikes can degrade efficiency, radiate noise into the circuit, and lead to device over-voltage stress. Careful component layout and printed circuit design minimizes the voltage spikes in the converter. Consider, as an example, the turnoff transition of the upper MOSFET. Prior to turnoff, the upper MOSFET was carrying the full load current. During the turnoff, current stops flowing in the upper MOSFET and is picked up by the lower MOSFET or Schottky diode. Any inductance in the switched current path generates a large voltage spike during the switching interval. Careful component selection, tight layout of the critical components, and short, wide circuit traces minimize the magnitude of voltage spikes. Contact Intersil for evaluation board drawings of the component placement and printed circuit board. There are two sets of critical components in a DC-DC converter using a HIP6019 controller. The power components are the most critical because they switch large amounts of energy. The critical small signal components connect to sensitive nodes or supply critical bypassing current. The power components should be placed first. Locate the input capacitors close to the power switches. Minimize the length of the connections between the input capacitors and the power switches. Locate the output inductor and output capacitors between the MOSFETs and the load. Locate the PWM controller close to the MOSFETs. The critical small signal components include the bypass capacitor for VCC and the soft-start capacitor, CSS. Locate these components close to their connecting pins on the control IC. Minimize any leakage current paths from SS node because the internal current source is only 11 µA. A multi-layer printed circuit board is recommended. Figure 10 shows the connections of the critical components in the converter. Note that capacitors CIN and COUT could each represent numerous physical capacitors. Dedicate one solid layer for a ground plane and make all critical component ground connections with vias to this layer. Dedicate another solid layer as a power plane and break this plane into smaller islands of common voltage levels. The power plane should support the input power and output power nodes. Use copper filled polygons on the top and bottom circuit layers for the phase nodes. Use the remaining printed circuit layers for small signal wiring. The wiring traces from the control IC to the MOSFET gate and source should be sized to carry 1A currents. The traces for OUT4 need only be sized for 0.2A. Locate COUT4 close to the HIP6019 IC. PWM Controller Feedback Compensation Both PWM controllers use voltage-mode control for output regulation. This section highlights the design consideration for a voltage-mode controller. Apply the methods and considerations to both PWM controllers. Figure 11 highlights the voltage-mode control loop for a synchronous-rectified buck converter. The output voltage is regulated to the reference voltage level. The reference voltage level is the DAC output voltage for PWM1 and is 1.265V for PWM2. The error amplifier output (VE/A) is compared with the oscillator (OSC) triangular wave to provide a pulse-width modulated wave with an amplitude of VIN at the PHASE node. The PWM wave is smoothed by the output filter (LO and CO). 11000 2.7 10111 2.8 10110 2.9 10101 3.0 10100 3.1 10011 3.2 10010 3.3 10001 3.4 10000 3.5 NOTE: 0 = connected to GND or VSS, 1 = open or connected to 5V through pull-up resistors, X = don’t care. TABLE 1. VOUT1 VOLTAGE PROGRAM (Continued) PIN NAME NOMINAL OUT1 VOLTAGE DACOUT VID4 VID3 VID2 VID1 VID0 FIGURE 10. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS VOUT1 Q1 Q2 Q3 Q4 CSS +12V CVCC VIA CONNECTION TO GROUND PLANE ISLAND ON POWER PLANE LAYER ISLAND ON CIRCUIT PLANE LAYER LOUT1 COUT1 CR1 HIP6019 CIN COUT2 VOUT2 VOUT3 +5VIN SS PGND LGATE1 UGATE1 PHASE1 GATE3 PHASE2 KEY LOUT2 GND VCC UGATE2 OCSET1 OCSET2 ROCSET1 ROCSET2 COCSET1 COCSET2 HIP6019 |
Similar Part No. - HIP6019CB |
|
Similar Description - HIP6019CB |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |