SMD Type

MOSFET

3

www.kexin.com.cn

Typical Characteristics

Fig 1. Normalized total power dissipation as a

function of solder point temperature.

Fig 2. Normalized continuous drain current as a

function of solder point temperature.

Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.

0

20

40

60

80

100

120

0

25

50

75

100

125

150

175

Pder

Tsp (

oC)

(%)

0

20

40

60

80

100

120

0

25

50

75

100

125

150

175

Ider (%)

Tsp (

oC)

P

tot 25 C

°

---------------------- 100%

×

=

I

D 25 C

°

------------------- 100%

×

=

10-2

10-1

1

0

1

0

1

1

2

VDS (V)

ID

(A)

D.C.

100 ms

10 ms

RDSon = VDS/ ID

1 ms

tp = 10 µs

100 µs

Tsp = 25oC

tp

tp

T

P

t

T

Mounted on a metal clad substrate.

Fig 4. Transient thermal impedance from junction to solder point as a function of

pulse duration.

03aa47

Zth(j-sp)

(K/W)

δ

tp

tp

T

P

t

T

BSN20

（　　　）

（　　　）