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PMPS150E_1206 Datasheet(PDF) 3 Page - Protek Devices |
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PMPS150E_1206 Datasheet(HTML) 3 Page - Protek Devices |
3 / 6 page Only One Name Means ProTek’Tion™ www.protekdevices.com 05430.R1 10/13 Page 3 PMPS150E-1206 TYPICAL DEVICE CHARACTERISTICS SOLDERING PARAMETERS PROFILE FEATURES PB-FREE ASSEMBLY Average Ramp-Up Rate - Tsmin to Tp 3°C/Second Max Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) 150°C 200°C 60-180 Seconds Time Maintained Above: - Temperature (Tm) - Time (tm) 217°C 60-150 Seconds Peak Temperature (Tp) 260°C Time within 5°C of Tp (tp) 20-40 Seconds Ramp-Down Rate 6°C/Seconds Max Time 25°C to Tp 8 Minutes Max 1. All temperatures refer to topside of the package, mea- sured on the package body surface. 2. Recommended reflow methods: IR, Vapor Phase, Hot Air Oven. 3. Devices are not designed to be wave soldered to the bot- tom side of the board. 4. Devices can be cleaned using standard industry methods and solvents. 5. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. t 25°C to Peak Time Ramp-Down ts Preheat Tsmin Tsmax Tm Tp tm Ramp-Up Tp Critical Zone Tm to Tp NOTICES The devices are intended for protection against overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions are antici- pated. Operation beyond maximum ratings or improper use may result in device damage and possible arcing and flame. WARNING Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. Polymeric thermistors operate by thermal expansion of the conductive polymer. If devices are placed under pressure or installed in space that would prevent thermal expansion, they may not properly protect against fault conditions. Designs must be selected in such a manner that adequate space is maintained over the life of the product. Twisting, bending, or placing the Polymeric thermistors in tension will decrease the ability of the device to protect against electrical faults. No residual force should remain on the device after installation. Mechanical damage to Polymeric thermistors chip may affect device performance and should be avoided. Chemical contamination of Polymeric thermistors should be avoided. Certain greases, solvents, hydraulic fluids, fuels, industrial cleaning agents, volatile components of adhesives, silicones and electrolytes can have an adverse effect on the device performance. Environmental conditions must not harm the thermistors. Use thermistors only in normal atmospheric conditions. Avoid use in deoxidizing gases, corrosive agents, humid or salty conditions. Contact with any liquids and solvents should be prevented. Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal and mechanical procedures for electronic components. |
Similar Part No. - PMPS150E_1206_15 |
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Similar Description - PMPS150E_1206_15 |
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