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HUF76131SK8 Datasheet(PDF) 7 Page - Intersil Corporation |
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HUF76131SK8 Datasheet(HTML) 7 Page - Intersil Corporation |
7 / 10 page 7 Thermal Resistance vs Mounting Pad Area The maximum rated junction temperature TJMAX constrains the maximum allowable device power dissipation PDmax in an application. The application ambient temperature TA ( oC) and thermal impedance ZθJA ( oC/W) must be reviewed to ensure that TJMAX ( oC) is never exceeded. Equation 1 mathematically represents the relationship. Intersil provides thermal information to assist the designer’s preliminary application evaluation. Precise determination of PDMAX is complex and influenced by many factors: 1. PC heat sink area and location (top and bottom), copper leads and mounting pad area. 2. Air Flow, board orientation and type. 3. Power pulse width and duty factor. Figure 22 addresses these points by depicting RθJA values vs. top copper (component side) heat sink area. The measurements were performed in still air using a horizontally positioned FR-4 board with 1oz copper after 1000 seconds of steady state power. Figure 22 also displays the two RθJA values listed in the Electrical Specifications table. The two points were chosen to graphically depict the compromise between copper board area, thermal resistance and ultimately power dissipation. Thermal resistance values corresponding to other component side copper areas can be obtained from Figure 22 or by calculation using Equation 2. Area in Equation 2 is the top copper area including the gate and source pads. Figure 22 provides the necessary information for steady state junction temperature or power dissipation calculations. Transient pulse applications are best studied using the Intersil device SPICE thermal model. (EQ. 1) P DMAX T JMAX T A – () ZθJA ---------------------------------------- = (EQ. 2) RθJA 79.3 21.8 Area () ln × – = 50 100 150 200 AREA, TOP COPPER AREA (in2) 0.01 0.1 1.0 RθJA = 79.3 - 21.8*ln(AREA) 143.4oC/W - 0.054in2 177.3oC/W - 0.0115in2 IGURE 22. THERMAL RESISTANCE vs MOUNTING PAD AREA 0.001 250 HUF76131SK8 |
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