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W9816G6JH-6 Datasheet(PDF) 5 Page - Winbond |
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W9816G6JH-6 Datasheet(HTML) 5 Page - Winbond |
5 / 42 page W9816G6JH Publication Release Date: Jun. 24, 2014 - 5 - Revision: A01 5. PIN DESCRIPTION PIN NUMBER PIN NAME FUNCTION DESCRIPTION 20 24, 27 32 A0 A10 Address Multiplexed pins for row and column address. Row address: A0 A10. Column address: A0A7. 19 BA Bank Select Select bank to activate during row address latch time, or bank to read/write during column address latch time. 2, 3, 5, 6, 8, 9, 11, 12, 39, 40, 42, 43, 45, 46, 48, 49 DQ0 DQ15 Data Input/ Output Multiplexed pins for data input and output. 18 CS Chip Select Disable or enable the command decoder. When command decoder is disabled, new command is ignored and previous operation continues. 17 R A S Row Address Strobe Command input. When sampled at the rising edge of the clock, R A S , C A S and WE define the operation to be executed. 16 C A S Column Address Strobe Referred to R A S 15 WE Write Enable Referred to R A S 36, 14 UDQM/ LDQM Input/Output Mask The output buffer is placed at Hi-Z (with latency of 2) when DQM is sampled high in read cycle. In write cycle, sampling DQM high will block the write operation with zero latency. 35 CLK Clock Inputs System clock used to sample inputs on the rising edge of clock. 34 CKE Clock Enable CKE controls the clock activation and deactivation. When CKE is low, Power Down mode, Suspend mode, or Self Refresh mode is entered. 1, 25 VDD Power Power for input buffers and logic circuit inside DRAM. 26, 50 VSS Ground Ground for input buffers and logic circuit inside DRAM. 7, 13, 38, 44, VDDQ Power for I/O buffer Separated power from VDD, used for output buffers to improve noise immunity. 4, 10, 41, 47 VSSQ Ground for I/O buffer Separated ground from VSS, used for output buffers to improve noise immunity. 33, 37 NC No Connection No connection. |
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