ADM8832

Rev. A | Page 11 of 12

OUTLINE DIMENSIONS

1

20

5

6

11

16

15

10

2.25

2.10 SQ

1.95

0.75

0.55

0.35

0.30

0.23

0.18

0.50

BSC

12° MAX

0.20

REF

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.90

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BCS SQ

4.00

BSC SQ

COPLANARITY

0.08

0.60

MAX

0.60

MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1

Figure 20. 20-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body

(CP-20)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADM8832ACP

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20

ADM8832ACP-REEL

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20

ADM8832ACP-REEL7

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20

ADM8832ACPZ1

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20

ADM8832ACPZ-REEL1

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20

ADM8832ACPZ-REEL71

−40°C to +85°C

Lead Frame Chip Scale Package

CP-20