SMD Type

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5

MOSFET

■

Typical Characterisitics

Figure 14. Maximum Safe Operating Area.

Figure 17. Transient Thermal Response Curve.

Note : Characterization performed using the conditions described in note 1b. Transient thermal response will

change depending on the circuit board design.

-5

-4

-3

-2

-1

0

0

0.5

1

1.5

2

2.5

3

I , DRAIN CURRENT (A)

T = -55°C

J

25°C

D

V

= - 5V

DS

125°C

0.1

0.2

0.5

1

2

5

10

20 30

50

0.01

0.05

0.1

0.5

1

2

5

10

20

- V

, DRAIN-SOURCE VOLTAGE (V)

RD

S(O

N) L

IMIT

A

DC

DS

1s

100m

s

10ms

1ms

10s

V

= -4.5V

SINGLE PULSE

R

= See Note 1b

T = 25°C

θJA

GS

A

0

0.1

0.2

0.3

0.4

0.6

0.7

0.8

0.9

1

1.1

1.2

2oz COPPER MOUNTING PAD AREA (in )

2

1b

1a

4.5"x5" FR-4 Board

T = 25 C

Still Air

V = -4.5V

A

o

GS

0

0.1

0.2

0.3

0.4

0

0.2

0.4

0.6

0.8

1

2oz COPPER MOUNTING PAD AREA (in )

2

1b

1a

2

1b

4.5"x5" FR-4 Board

T = 25 C

Still Air

A

o

Steady-State Power Dissipation versus

Copper Mounting Pad Area.

Figure 13. Transconductance Variation with Drain

Current and Temperature

.

Figure 16. Maximum Steady-State Drain

Current versus Copper Mounting Pad Area

.

0.0001

0.001

0.01

0.1

1

10

100

300

0.001

0.002

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

Duty Cycle, D = t /t

1 2

R

(t) = r(t) * R

R

= See Note 1b

θ

JA

θ

JA

θ

JA

T - T = P * R

(t)

θ

JA

A

J

P(pk)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2