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ALN2313R2 Datasheet(PDF) 1 Page - Advanced Semiconductor Business Inc. |
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ALN2313R2 Datasheet(HTML) 1 Page - Advanced Semiconductor Business Inc. |
1 / 3 page 1/3 www.asb.co.kr November 2008 plerowTM ALN2313R2 Internally Matched LNA Module The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi- cation terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Parameter Unit Specifications Min Typ Max Frequency Range MHz 2300 2326 Gain dB 19 20 Gain Flatness dB 0.2 0.3 Noise Figure dB 1.1 1.15 Output IP3 (1) dBm 36 38 S11 / S22 (2) dB -18 / -10 Output P1dB dBm 20 21 Switching Time (3) sec - Supply Current mA 120 140 Supply Voltage V 5 Impedance 50 Max. RF Input Power dBm C.W 23 ~ 25 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Operating temperature is -40 C to +85C. 1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Pin Number Function 2 RF In 4 +Vcc 6 RF Out Others Ground Outline Drawing (Unit: mm) Features · S21 = 20.2 dB @ 2300 MHz = 19.8 dB @ 2326 MHz · NF of 1.1 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Description (Recommended Footprint) ALN2313R2 ASB Inc. (Top View) (Bottom View) Ø 0.4 plated thru holes to ground plane plerow (Side View) Solder Stencil Area Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 More Information 2-stage Single Type Specifications (in Production) Typ. @ T = 25 C, Vs = 5 V, Freq. = 2313 MHz, Zo.sys = 50 ohm |
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Similar Description - ALN2313R2_13 |
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