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ALN1810 Datasheet(PDF) 1 Page - Advanced Semiconductor Business Inc.

Part # ALN1810
Description  Internally Matched LNA Module
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Manufacturer  ASB [Advanced Semiconductor Business Inc.]
Direct Link  http://www.asb.co.kr
Logo ASB - Advanced Semiconductor Business Inc.

ALN1810 Datasheet(HTML) 1 Page - Advanced Semiconductor Business Inc.

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www.asb.co.kr
September 2007
plerowTM ALN1810
Internally Matched LNA Module
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Parameter
Unit
Specifications
Min
Typ
Max
Frequency Range
MHz
1750
1870
Gain
dB
29
30
Gain Flatness
dB
 0.5
 0.7
Noise Figure
dB
0.9
0.95
Output IP3 (1)
dBm
36
37
S11 / S22 (2)
dB
-14 / -14
Output P1dB
dBm
18
19
Switching Time (3)
sec
-
Supply Current
mA
80
100
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 29 ~ 31 (before fail)
Package Type & Size
mm
Surface Mount Type, 13Wx13Lx3.8H
Operating temperature is -40
C to +85C.
1) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Pin Number
Function
3
RF In
8
RF Out
10
+Vcc
Others
Ground
Outline Drawing (Unit: mm)
·
30 dB Gain at 1810 MHz
·
19 dBm P1dB
·
37 dBm Output IP3
·
0.9 dB Noise Figure
·
Operating at Single 5 V Supply
·
80 mA Current Consumption
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
ALN1810
ASB Inc.
(Top View)
(Bottom View)
Solder Stencil Area
Ø
0.4 plated thru holes to ground plane
plerow
(Side View)
(Recommended Footprint)
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
More Information
2-stage Single Type
Features
Description
Specifications (in Production)
Typ. @ T = 25
C, Vs = 5 V, Freq. =1810 MHz, Zo.sys = 50 ohm


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