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RF1K49088 Datasheet(PDF) 6 Page - Intersil Corporation |
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RF1K49088 Datasheet(HTML) 6 Page - Intersil Corporation |
6 / 7 page 8-99 Soldering Precautions The soldering process creates a considerable thermal stress on any semiconductor component. The melting temperature of solder is higher than the maximum rated temperature of the device. The amount of time the device is heated to a high temperature should be minimized to assure device reliability. Therefore, the following precautions should always be observed in order to minimize the thermal stress to which the devices are subjected. 1. Always preheat the device. 2. The delta temperature between the preheat and soldering should always be less than 100oC. Failure to preheat the device can result in excessive thermal stress which can damage the device. 3. The maximum temperature gradient should be less than 5oC per second when changing from preheating to soldering. 4. The peak temperature in the soldering process should be at least 30oC higher than the melting point of the solder chosen. 5. The maximum soldering temperature and time must not exceed 260oC for 10 seconds on the leads and case of the device. 6. After soldering is complete, the device should be allowed to cool naturally for at least three minutes, as forced cool- ing will increase the temperature gradient and may result in latent failure due to mechanical stress. 7. During cooling, mechanical stress or shock should be avoided. FIGURE 18. SWITCHING TIME TEST CIRCUIT FIGURE 19. RESISTIVE SWITCHING WAVEFORMS FIGURE 20. GATE CHARGE TEST CIRCUIT FIGURE 21. GATE CHARGE WAVEFORMS Test Circuits and Waveforms (Continued) VGS RL RG DUT + - VDD tON td(ON) tr 90% 10% VDS 90% 10% tf td(OFF) tOFF 90% 50% 50% 10% PULSE WIDTH VGS 0 0 0.3 µF 12V BATTERY 50k Ω VDS S DUT D G Ig(REF) 0 (ISOLATED VDS 0.2 µF CURRENT REGULATOR ID CURRENT SAMPLING IG CURRENT SAMPLING SUPPLY) RESISTOR RESISTOR SAME TYPE AS DUT VDD Qg(TH) VGS = 1V Qg(5) VGS = 5V Qg(TOT) VGS = 10V VDS VGS Ig(REF) 0 0 RF1K49088 |
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Similar Description - RF1K49088 |
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