8-99

Soldering Precautions

The soldering process creates a considerable thermal stress

on any semiconductor component. The melting temperature

of solder is higher than the maximum rated temperature of

the device. The amount of time the device is heated to a high

temperature should be minimized to assure device reliability.

Therefore, the following precautions should always be

observed in order to minimize the thermal stress to which

the devices are subjected.

1. Always preheat the device.

2. The delta temperature between the preheat and soldering

device can result in excessive thermal stress which can

damage the device.

per second when changing from preheating to soldering.

4. The peak temperature in the soldering process should be

chosen.

5. The maximum soldering temperature and time must not

the device.

6. After soldering is complete, the device should be allowed

to cool naturally for at least three minutes, as forced cool-

ing will increase the temperature gradient and may result

in latent failure due to mechanical stress.

7. During cooling, mechanical stress or shock should be

avoided.

FIGURE 18. SWITCHING TIME TEST CIRCUIT

FIGURE 19. RESISTIVE SWITCHING WAVEFORMS

FIGURE 20. GATE CHARGE TEST CIRCUIT

FIGURE 21. GATE CHARGE WAVEFORMS

DUT

+

-

90%

10%

90%

10%

90%

50%

50%

10%

PULSE WIDTH

0

0

0.3

µF

12V

BATTERY

50k

Ω

S

DUT

D

G

0

(ISOLATED

0.2

µF

CURRENT

REGULATOR

SAMPLING

SAMPLING

SUPPLY)

RESISTOR

RESISTOR

SAME TYPE

AS DUT

0

0

RF1K49088