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UPC79M08HF Datasheet(PDF) 9 Page - NEC |
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UPC79M08HF Datasheet(HTML) 9 Page - NEC |
9 / 12 page µPC79M00 Series 9 RECOMMENDED SOLDERING CONDITIONS When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Type of Through-hole Devices µPC79M05HF, 79M08HF, 79M12HF, 79M15HF, 79M18HF, 79M24HF: 3-pin plastic SIP (MP-45G) Process Conditions Wave soldering Solder temperature: 260 °C or below, (only to leads) Flow time: 10 seconds or less. Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. REFERENCE DOCUMENTS Quality Grades on NEC Semiconductor Devices C11531E Semiconductor Device Mounting Technology Manual C10535E IC Package Manual C10943X Guide to Quality Assurance for Semiconductor Devices MEI-1202 Semiconductors Selection Guide X10679E NEC Semiconductor Device Reliability/Quality Control System IEI-1212 -Three Terminal Regulator |
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