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NP80N04KHE-E2-AYNote1 Datasheet(PDF) 11 Page - Renesas Technology Corp |
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NP80N04KHE-E2-AYNote1 Datasheet(HTML) 11 Page - Renesas Technology Corp |
11 / 12 page Data Sheet D14239EJ7V0DS 9 NP80N04EHE, NP80N04KHE, NP80N04CHE, NP80N04DHE, NP80N04MHE, NP80N04NHE TAPE INFORMATION There are two types (-E1, -E2) of taping depending on the direction of the device. Reel side Draw-out side MARKING INFORMATION 80N04 Lot code NEC HE Pb-free plating marking Abbreviation of part number RECOMMENDED SOLDERING CONDITIONS These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, please contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow MP-25ZJ, MP-25ZK Maximum temperature (Package's surface temperature): 260 °C or below Time at maximum temperature: 10 seconds or less Time of temperature higher than 220 °C: 60 seconds or less Preheating time at 160 to 180 °C: 60 to 120 seconds Maximum number of reflow processes: 3 times Maximum chlorine content of rosin flux (percentage mass): 0.2% or less IR60-00-3 Wave soldering MP-25, MP-25K, MP-25SK, MP-25 Fin Cut Maximum temperature (Solder temperature): 260 °C or below Time: 10 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less THDWS Partial heating MP-25ZJ, MP-25ZK, MP-25K, MP-25SK Maximum temperature (Pin temperature): 350 °C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less P350 Partial heating MP-25, MP-25 Fin Cut Maximum temperature (Pin temperature): 300 °C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less P300 Caution Do not use different soldering methods together (except for partial heating). |
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