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NP80N06MLG-S18-AYNote Datasheet(PDF) 11 Page - Renesas Technology Corp |
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NP80N06MLG-S18-AYNote Datasheet(HTML) 11 Page - Renesas Technology Corp |
11 / 12 page Data Sheet D19798EJ1V0DS 9 NP80N06MLG, NP80N06NLG, NP80N06PLG TAPE INFORMATION (NP80N06PLG) There are two types (-E1B, -E2B) of taping depending on the direction of the device. Reel side Draw-out side −E1B TYPE −E2B TYPE MARKING INFORMATION 80N06 Lot code NEC LG Pb-free plating marking Abbreviation of part number RECOMMENDED SOLDERING CONDITIONS These products should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, please contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Soldering Method Soldering Conditions Recommended Condition Symbol Infrared reflow NP80N06PLG Maximum temperature (Package's surface temperature): 260 °C or below Time at maximum temperature: 10 seconds or less Time of temperature higher than 220 °C: 60 seconds or less Preheating time at 160 to 180 °C: 60 to 120 seconds Maximum number of reflow processes: 3 times Maximum chlorine content of rosin flux (percentage mass): 0.2% or less IR60-00-3 Wave soldering NP80N06MLG, NP80N06NLG Maximum temperature (Solder temperature): 260 °C or below Time: 10 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less THDWS Partial heating NP80N06MLG, NP80N06NLG, NP80N06PLG Maximum temperature (Pin temperature): 350 °C or below Time (per side of the device): 3 seconds or less Maximum chlorine content of rosin flux: 0.2% (wt.) or less P350 Caution Do not use different soldering methods together (except for partial heating). |
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