µPD16823

7

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions shown below.

For soldering methods and conditions other than those listed below, consult NEC.

For details of the recommended soldering conditions, refer to Information Document “Semiconductor Device

Mounting Technology Manual” (C10535E).

Soldering Method

Soldering Condition

Symbol of Recommended

Soldering

Infrared reflow

Package peak temperature: 235

°C, Time: 30 seconds MAX. (210 °C MIN.)

IR35-00-2

flux with little chlorine component (chlorine: 0.2 Wt% MAX.)

VPS

Package peak temperature: 215

°C, Time: 40 seconds MAX. (200 °C MIN.)

VP15-00-2

flux with little chlorine component (chlorine: 0.2 Wt% MAX.)

Wave soldering

Package peak temperature: 260

°C, Time: 10 seconds MAX.,

WS60-00-1

Preheating temperature: 120

°C MAX., Number of times: 1, Flux:

Rosin-based flux with little chlorine component (chlorine: 0.2 Wt% MAX.)

Note The number of days during which the product can be stored at 25

°C 65% RH MAX. after the dry pack was

opened.

Caution Do not use two or more soldering methods in combination.

REFERENCE DOCUMENTS

Document Name

Document No.

NEC Semiconductor Device Reliability/Quality Control System

C11745E

Guide to Quality Assurance for Semiconductor Devices

MEI-1202

Safe Operating Area of Power MOS FET

TEA-1037