Specifications and information are subject to change without notice

TriQuint Semiconductor, Inc

Phone +1-503-615-9000

FAX: +1-503-615-8900

e-mail: info-sales@tqs.com

Web site: www.TriQuint.com

Page 5 of 5

August 2009

AG303-63

InGaP HBT Gain Block

Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 C reflow temperature) and leaded

(maximum 245 C reflow temperature) soldering processes. The plating material on the leads is annealed matte tin over copper.

Outline Drawing

JXX

Land Pattern

Product Marking

The component will be marked with a “J”

designator followed by a two-digit numeric lot

code on the top surface of the package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

MSL / ESD Rating

ESD Rating: Class 1C

Value:

Passes

1000V min.

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes

1000V min.

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating: Level 3 at +260 C convection reflow

Standard:

JEDEC Standard J-STD-020

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper

performance of this device.

Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated thru

diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via

region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in

the region where the board contacts the heatsink.

5. RF trace width depends upon the PC board material and

construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in

degrees.