Specifications and information are subject to change without notice

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com

Page 6 of 6 December 2007

AH103A

High Gain, High Linearity ½-Watt Amplifier

AH103A-G (Lead-Free Package) Mechanical Information

This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free

(maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes.

Outline Drawing

Mounting Configuration / Land Pattern

Product Marking

The component will be marked with an

“103AG” designator followed by a alpha-

numeric lot code on the top surface of the

package.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

ESD / MSL Information

ESD Rating:

Class 1B

Value:

Passes

500 V to <1000 V

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

ESD Rating:

Class III

Value:

Passes

500 V to <1000 V

Test:

Charged Device Model (CDM)

Standard:

JEDEC Standard JESD22-C101

MSL Rating:

Level 2 at +260 °C convection reflow

Standard:

JEDEC Standard J-STD-020

Functional Pin Layout

Pin

Function

1

Amp2 input

2

Amp1 output / Bias Amp1

3, 5, 8

Ground

4

RF input (Amp1 input)

6

RF output (Amp2 output)

7

Bias Amp2

The backside paddle is the Source and should be

grounded for thermal and electrical purposes. All

other pins should be grounded on the PCB.

Mounting Config. Notes

1.

Ground / thermal vias are critical for the proper performance

of this device.

Vias should use a .35mm (#80 / .0135”)

diameter drill and have a final plated thru diameter of .25

mm (.010”).

2.

Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3.

To ensure reliable operation, device ground paddle-to-

ground pad solder joint is critical.

4.

Add mounting screws near the part to fasten the board to a

heatsink.

Ensure that the ground / thermal via region

contacts the heatsink.

5.

For optimal thermal performance, expose soldermask on

backside where it contacts the heatsink.

6.

RF trace width depends upon the PC board material and

construction.

7.

Use 1 oz. Copper minimum.

8.

All dimensions are in millimeters. Angles are in degrees.

9.

A heatsink underneath the area of the PCB for the mounted

device is strictly required for proper thermal operation.

Damage to the device can occur without the use of one.