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AH103A-PCB900 Datasheet(PDF) 6 Page - TriQuint Semiconductor |
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AH103A-PCB900 Datasheet(HTML) 6 Page - TriQuint Semiconductor |
6 / 6 page Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: sales@wj.com • Web site: www.wj.com, www.TriQuint.com Page 6 of 6 December 2007 AH103A High Gain, High Linearity ½-Watt Amplifier AH103A-G (Lead-Free Package) Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes. Outline Drawing Mounting Configuration / Land Pattern Product Marking The component will be marked with an “103AG” designator followed by a alpha- numeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes 500 V to <1000 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 ESD Rating: Class III Value: Passes 500 V to <1000 V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD22-C101 MSL Rating: Level 2 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Functional Pin Layout Pin Function 1 Amp2 input 2 Amp1 output / Bias Amp1 3, 5, 8 Ground 4 RF input (Amp1 input) 6 RF output (Amp2 output) 7 Bias Amp2 The backside paddle is the Source and should be grounded for thermal and electrical purposes. All other pins should be grounded on the PCB. Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. To ensure reliable operation, device ground paddle-to- ground pad solder joint is critical. 4. Add mounting screws near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. For optimal thermal performance, expose soldermask on backside where it contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters. Angles are in degrees. 9. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. |
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