Model. No.

Rev.

■

■

■

■

Precautions for use:

1. Storage

Any mechanical force or any excess vibration shall not be accepted to apply during cooling process

to normal temperature after soldering.

Avoid quick cooling.

Lead frames are silver plated copper alloy. The silver plate surface may be affected by

environments which contains corrosive substances. Please avoid conditions which may cause the LEDs

to corrode,tarnish or discolour.

2. Soldering

Recommended soldering profile:

Position

Not less than 3mm from the

base of the epoxy

Solder=Sn 63-Pb 37

Solder= Pb-Free

Peak preheat temperature:100-110

℃

Peak preheat temperature:100-110

℃

Model No.

：

：

：

：

FYLF-1140UR1C

Http://www.foryard.com

280

℃

max(63/37 Solder)

300

℃

max(Pb free solder)

3 seconds max.

Position

Not less than 3mm from

the base of the epoxy

Preheat time

Solder temperature

A

FYLF-1140UR1C

110

℃

max

Temperature

Dipping Time

60 seconds max.

63/37 Solder:235

℃

(245

℃

max)

Pb-free solder:255

℃

(260

℃

max)

3 seconds max.

Manual Soldering

Solder Dipping

Soldering Iron

35W max.

Preheat

Soldering Time

Total preheat time:50-60seconds

Total preheat time:50-60seconds

Peak profile fit temperature:235

℃

(max 245

℃

)

Peak profile fit temperature:260

℃

max

Dwell time above 200

℃

should not exceed 3 seconds

Dwell time above 200

℃

should not exceed 3 seconds

Times(Sec)

50

100

150

200

250

300

0

0

10

20

30

40

50

60

70

80

90

100

110

120

Temperature( )

Preheat

laminar wave