Parameter

Max.

Units

5.2

3.3

A

Pulsed Drain Current

21

Power Dissipation

50

Power Dissipation (PCB Mount)**

3.1

Linear Derating Factor

0.40

Linear Derating Factor (PCB Mount)**

0.025

Gate-to-Source Voltage

±10

V

Single Pulse Avalanche Energy

125

mJ

Avalanche Current

5.2

A

Repetitive Avalanche Energy

5.0

mJ

dv/dt

Peak Diode Recovery dv/dt

5.0

V/ns

Junction and Storage Temperature Range

-55 to + 150

Soldering Temperature, for 10 seconds

300 (1.6mm from case)

IRL620S

PD -9.1218

Revision 0

Absolute Maximum Ratings

Thermal Resistance

Parameter

Min.

Typ.

Max.

Units

Junction-to-Case

—

—

2.5

Junction-to-Ambient (PCB Mount)**

—

—

40

°C/W

Junction-to-Ambient

—

—

62

Surface Mount

Available in Tape & Reel

Dynamic dv/dt Rating

Repetitive Avalanche Rated

Logic-Level Gate Drive

Fast Switching

Third Generation HEXFETs from International Rectifier provide the designer

with the best combination of fast switching, ruggedized device design, low on-

resistance and cost-effectiveness.

The SMD-220 is a surface-mount power package capable of accommodating die

sizes up to HEX-4. It provides the highest power capability and the lowest possible

on-resistance in any existing surface-mount package. The SMD-220 is suitable for

high current applications because of its low internal connection resistance and can

dissipate up to 2.0W in a typical surface-mount application.

Description

A

SMD-220

W

W/°C

°C

** When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques, refer

to Application Note AN-994.

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