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TGA2627-SM Datasheet(PDF) 11 Page - TriQuint Semiconductor |
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TGA2627-SM Datasheet(HTML) 11 Page - TriQuint Semiconductor |
11 / 16 page TGA2627-SM 6 - 12 GHz GaN Driver Amplifier Preliminary Datasheet: Rev - 09-05-14 - 11 of 16 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Applications Information Evaluation Board Layout RF Layer is 0.008” thick Rogers Corp. RO4003C, εr = 3.38. Metal layers are 0.5 oz. copper. The microstrip line at the connector interface is optimized for the Southwest Microwave end launch connector 1092-02A- 5. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. Bill of Materials Ref. Designation Value Description Manufacturer Part Number C1 – C4, C7, C8 0.01 pF Cap., 50V, 10% X7R, 0402 case Various C5, C6, C9, C10 1.0 uF Cap., 50V, 10% X5R, 1206 case Various R1 – R4, R7, R8 5.1 Ohms Resistor, 0402 case Various R5, R6, R9, R10 0.0 Ohms Resistor, 0402 case Various |
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