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TGA2904-FL

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Assembly of a TGA2904-FL Surface Mount Package onto a Motherboard

Manual Assembly for Prototypes

1. Clean the motherboard or module. Rinse with alcohol and DI water. Allow the circuit to fully dry.

2. To improve the thermal and RF performance, a heat sink attached to the bottom of the package is

recommended. Apply indium alloy, SN63 solder or tin/lead solder to the bottom of TGA2904-FL.

3. Apply tin/lead solder to each pin of TGA2904-FL.

4 Clean the assembly with alcohol.

Ordering Information

Part

Package Style

TGA2904-FL

Flange Lead

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.