9

TGA4036

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Mechanical Drawing

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

1

2

3

4

5

6

0

0

0.299

(0.011)

1.065

(0.042)

1.603

(0.063)

1.688

(0.066)

0.389

(0.015)

0.665

(0.026)

1.328

(0.052)

0.593

(0.023)

0.085

(0.003)

0.750

(0.030)

0.445

(0.018)

0.085

(0.003)

Units: Millimeters (inches)

Thickness: 0.100 (0.004) (Reference Only)

Cip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

RF Ground is backside of MMIC

Bond pad #1:

Bond pad #2, #3:

Bond pad #4:

Bond pad #5, #6:

(RF In)

(Vd)

(RF Out)

(Vg)

0.080 x 0.150 (0.003 x 0.006)

0.080 x 0.080 (0.003 x 0.003)

0.080 x 0.150 (0.003 x 0.006)

0.080 x 0.080 (0.003 x 0.003)