TGA4502-SCC

10

TriQuint Semiconductor Texas Phone: www.triquint.com (972)994-8465 Fax (972)994 8504 Info-mmw@tqs.com

Oct 2008 © Rev -

Mechanical Drawing

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

0.000

0.686

(0.027)

0.833

(0.033)

0.098

(.004)

0.373

(0.015)

1.524

(0.060)

1

8

3

4

5

6

7

2

9

10

11

12

13

14

15

Bond pad #1

(RF Input)

0.200 x 0.100 (0.008 x 0.004)

Bond pad #2

(RF Output)

0.200 x 0.100 (0.008 x 0.004)

Bond pad #3

VG2

0.100 x 0.100 (0.004 x 0.004)

Bond pad #4

DQ

0.100 x 0.100 (0.004 x 0.004)

Bond pad #5

VG3

0.100 x 0.100 (0.004 x 0.004)

Bond pad #6

VD3

0.180 x 0.100 (0.007 x 0.004)

Bond pad #7

DET OUT

0.100 x 0.100 (0.004 x 0.004)

Bond pad #8

PWR DET

0.175 x 0.100 (0.007 x 0.004)

Bond pad #9

REF2

0.100 x 0.100 (0.004 x 0.004)

Bond pad #10

REF1

0.100 x 0.100 (0.004 x 0.004)

Bond pad #11

VD3

0.180 x 0.100 (0.007 x 0.004)

Bond pad #12

VG3

0.100 x 0.100 (0.004 x 0.004)

Bond pad #13

DQ

0.100 x 0.100 (0.004 x 0.004)

Bond pad #14

VG2

0.100 x 0.100 (0.004 x 0.004)

Bond pad #15

REF3

0.100 x 0.100 (0.004 x 0.004)

Units: Millimeters (inches)

Thickness: 0.100 (0.004) (reference only)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

1.382

(0.544)