TGA4502-SCC

11

TriQuint Semiconductor Texas Phone: www.triquint.com (972)994-8465 Fax (972)994 8504 Info-mmw@tqs.com

Oct 2008 © Rev -

Assembly Process Notes

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Reflow process assembly notes:

•

Use AuSn (80/20) solder with limited exposure to temperatures at or above 300 °C

(for 30 sec max).

•

An alloy station or conveyor furnace with reducing atmosphere should be used.

•

No fluxes should be utilized.

•

Coefficient of thermal expansion matching is critical for long-term reliability.

•

Devices must be stored in a dry nitrogen atmosphere.

Component placement and adhesive attachment assembly notes:

•

Vacuum pencils and/or vacuum collets are the preferred method of pick up.

•

Air bridges must be avoided during placement.

•

The force impact is critical during auto placement.

•

Organic attachment can be used in low-power applications.

•

Curing should be done in a convection oven; proper exhaust is a safety concern.

•

Microwave or radiant curing should not be used because of differential heating.

•

Coefficient of thermal expansion matching is critical.

Interconnect process assembly notes:

•

Thermosonic ball bonding is the preferred interconnect technique.

•

Force, time, and ultrasonics are critical parameters.

•

Aluminum wire should not be used.

•

Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire.

•

Maximum stage temperature is 200 °C.

Ordering Information

GaAs MMIC Die

TGA4502

Package Style

Part