9

TGA4506

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Chip Assembly Diagram

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Vd

Vg

RF In

RF Out

All three Vd pads (pad # 9, 10, 11 from mechanical drawing)

do not need to be connected