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TGA4508 Datasheet(PDF) 9 Page - TriQuint Semiconductor |
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TGA4508 Datasheet(HTML) 9 Page - TriQuint Semiconductor |
9 / 11 page 9 TGA4508 May 2009 © Rev - TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Mechanical Drawing GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 0.000 (0.000) 0.532 (0.021) 0.719 (0.028) 0.840 (0.033) 0.532 (0.021) Units: Millimeters (Inches) Thickness: 0.100 (0.004) Chip edge to bond pad dimensions are shown to center of bond pad Chip size tolerance: +/- 0.051 (0.002) GND IS BACKSIDE OF MMIC Bond pad #1 (RF In) 0.100 x 0.200 (0.004 x 0.008) Bond pad #2 (Vg) 0.100 x 0.100 (0.004 x 0.004) Bond pad #3 (Vd1,2) 0.100 x 0.100 (0.004 x 0.004) Bond pad #4 (Vd3) 0.100 x 0.100 (0.004 x 0.004) Bond pad #5 (RF Out) 0.100 x 0.200 (0.004 x 0.008) 1 23 4 5 |
Similar Part No. - TGA4508_15 |
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Similar Description - TGA4508_15 |
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