9

TGA4508

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

Mechanical Drawing

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

0.000 (0.000)

0.532 (0.021)

0.719 (0.028)

0.840 (0.033)

0.532 (0.021)

Units: Millimeters (Inches)

Thickness: 0.100 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

Bond pad #1

(RF In)

0.100 x 0.200 (0.004 x 0.008)

Bond pad #2

(Vg)

0.100 x 0.100 (0.004 x 0.004)

Bond pad #3

(Vd1,2)

0.100 x 0.100 (0.004 x 0.004)

Bond pad #4

(Vd3)

0.100 x 0.100 (0.004 x 0.004)

Bond pad #5

(RF Out) 0.100 x 0.200 (0.004 x 0.008)

1

23

4

5