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MAAD-011021-000DIE Datasheet(PDF) 8 Page - M/A-COM Technology Solutions, Inc.

Part # MAAD-011021-000DIE
Description  Digital Attenuator
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MAAD-011021-000DIE Datasheet(HTML) 8 Page - M/A-COM Technology Solutions, Inc.

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Digital Attenuator, 6-Bit, 0.5 dB LSB step
DC - 40 GHz
Rev. V1
MAAD-011021-000DIE
8
8
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
For further information and support please visit:
https://www.macomtech.com/content/customersupport
8
The MAAD-011021 is designed for extremely wide
band and robust attenuation applications. It uses a
combination of series and shunt cold channel,
multiple-gate FETs to achieve high linearity and
accurate attenuation repeatability. We recommend
using double bonds at both RF input and output, as
well as keeping bondwires as short as possible to
ensure higher frequency operation. This part is the
most accurate for X-band applications.
The MAAD-011021 has a built in inverter function
which allows a single +5 V / 0 V single control for
each bit. This is useful if you require very fast
switching times and have +5 V / 0 V available.
The MAAD-011021 is DC-coupled at both RFIN and
RFOUT. If operation at DC is desired, 0 Ω jumpers
(or continuous 50 Ω RF lines) should be used in
series with RFIN and RFOUT. Customer should take
extra care to ensure that the voltage at both RFIN
and RFOUT are 0 V; excess voltage can damage the
part. If operation at DC is not required, simply use
series blocking capacitors.
Application Information
Applications Section
The Monolithic Circuit is designed for robust and
reliable
usage.
The
die
features
complete
passivation on all critical areas as well as a
protective BCB die coat.
The die should be attached directly to the ground
plane with silver conductive epoxy for best results.
A true 50 Ω microstrip or co-planar waveguide is
recommended for bringing RF to and from the die
as shown in the demonstration board below. This
board uses 0.200 mm (8 mils) Rogers 4350 as the
top dielectric layer.
Alternatively one can mount the die directly to the
ground plane and launch with microstrip substrates
in either alumina or Rogers to the same level as
the top of the die, allowing for shorter bond wires.
The RF input and output pads are DC coupled.
Blocking capacitors are required if there is a DC
potential on either port.
Mounting and Bonding Techniques
PCB Layout
Sample board size above is 28 x 25 mm


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