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MAAD-011021-000DIE Datasheet(PDF) 8 Page - M/A-COM Technology Solutions, Inc. |
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MAAD-011021-000DIE Datasheet(HTML) 8 Page - M/A-COM Technology Solutions, Inc. |
8 / 8 page Digital Attenuator, 6-Bit, 0.5 dB LSB step DC - 40 GHz Rev. V1 MAAD-011021-000DIE 8 8 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macomtech.com for additional data sheets and product information. For further information and support please visit: https://www.macomtech.com/content/customersupport 8 The MAAD-011021 is designed for extremely wide band and robust attenuation applications. It uses a combination of series and shunt cold channel, multiple-gate FETs to achieve high linearity and accurate attenuation repeatability. We recommend using double bonds at both RF input and output, as well as keeping bondwires as short as possible to ensure higher frequency operation. This part is the most accurate for X-band applications. The MAAD-011021 has a built in inverter function which allows a single +5 V / 0 V single control for each bit. This is useful if you require very fast switching times and have +5 V / 0 V available. The MAAD-011021 is DC-coupled at both RFIN and RFOUT. If operation at DC is desired, 0 Ω jumpers (or continuous 50 Ω RF lines) should be used in series with RFIN and RFOUT. Customer should take extra care to ensure that the voltage at both RFIN and RFOUT are 0 V; excess voltage can damage the part. If operation at DC is not required, simply use series blocking capacitors. Application Information Applications Section The Monolithic Circuit is designed for robust and reliable usage. The die features complete passivation on all critical areas as well as a protective BCB die coat. The die should be attached directly to the ground plane with silver conductive epoxy for best results. A true 50 Ω microstrip or co-planar waveguide is recommended for bringing RF to and from the die as shown in the demonstration board below. This board uses 0.200 mm (8 mils) Rogers 4350 as the top dielectric layer. Alternatively one can mount the die directly to the ground plane and launch with microstrip substrates in either alumina or Rogers to the same level as the top of the die, allowing for shorter bond wires. The RF input and output pads are DC coupled. Blocking capacitors are required if there is a DC potential on either port. Mounting and Bonding Techniques PCB Layout Sample board size above is 28 x 25 mm |
Similar Part No. - MAAD-011021-000DIE_15 |
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