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TGA4905-CP

May 2009 © Rev -

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

ORDERING INFORMATION

PART

PACKAGE STYLE

TGA4905-CP

CARRIER PLATE

Assembly of a TGA4905-CP into a Module

Manual Assembly for Prototypes

1. Clean the module with Acetone. Rinse with alcohol and DI water. Allow the module to fully dry.

2. To improve the thermal and RF performance, TriQuint recommends attaching a heatsink to the bottom

of the package. If the TGA4905 is mounted to the heatsink with mounting screws, an indium shim or other

compliant material should be inserted between the TGA4905 and the heatsink to reduce thermal contact

resistance due to air gaps. The TGA4905 may also be mounted with DieMat DM6030HK conductive epoxy

or an equivalent high thermal conductivity epoxy.

3. The DC and RF interconnects may be gold bondwires or gold ribbons. The RF interconnects should be

as short as possible. A minimum of two 1 mil wires are recommended for the RF Input, RF Output, Vg, and

Vd1. Six bondwires are recommended for Vd2.