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TGA4916 Datasheet(PDF) 11 Page - TriQuint Semiconductor |
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TGA4916 Datasheet(HTML) 11 Page - TriQuint Semiconductor |
11 / 12 page TGA4916 Recommended Assembly Diagram 20 Vg 1,2,3 Top + Bot RF IN 0.1 uF F 1 0.1 uF RF OUT 0.1 uF 1 F Vd 1,2,3 Top 11 Sept 2010 © Rev C TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. 1/ Bond only to hatched bond pads, designated in blue. Bonding to other areas may damage MMIC. 2/ For optimal performance, RF Input and RF Output should be bonded with 4 wires, using wedge bonding, or a gold ribbon. Alternatively, 3 ball bonds can be used. 3/ All DC connections from 0.1 uF decoupling caps to chip should have 2 bonds. 0.1 uF Vd 1,2,3 Bottom 0.1 uF 0.1 uF 1 F |
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