11

TGC4702-FC

November 2009 © Rev B

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Mechanical Drawing

Drawing is for chip face-up

Units: millimeters

Thickness: 0.380

Die x,y size tolerance: +/- 0.050

Chip edge to pillar dimensions are shown to center of pillar

Pillar #1,3,6,8,10,

11,13,16,18

RF CPW Ground

0.075 Ø

Pillar #2

IF Out (I)

0.075 Ø

Pillar #4, 10

DC Ground

0.075 Ø

Pillar #5, 9

Vb

0.075 Ø

Pillar #7

LO In

0.075 Ø

Pillar #12

IF Out (Q)

0.075 Ø

Pillar #17

RF In

0.075 Ø

Pillar #14, 15, 19, 20, 21

Mech. Support

Only

0.075 Ø

0.000

0.178

0.404

0.628

1.644

1.890

1.769

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

0.121

0.121

0.122

0.123

0.123

1.769

1.771

0.178

0.404

0.628

1.644