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TGC4702-FC Datasheet(PDF) 11 Page - TriQuint Semiconductor |
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TGC4702-FC Datasheet(HTML) 11 Page - TriQuint Semiconductor |
11 / 13 page 11 TGC4702-FC November 2009 © Rev B TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Mechanical Drawing Drawing is for chip face-up Units: millimeters Thickness: 0.380 Die x,y size tolerance: +/- 0.050 Chip edge to pillar dimensions are shown to center of pillar Pillar #1,3,6,8,10, 11,13,16,18 RF CPW Ground 0.075 Ø Pillar #2 IF Out (I) 0.075 Ø Pillar #4, 10 DC Ground 0.075 Ø Pillar #5, 9 Vb 0.075 Ø Pillar #7 LO In 0.075 Ø Pillar #12 IF Out (Q) 0.075 Ø Pillar #17 RF In 0.075 Ø Pillar #14, 15, 19, 20, 21 Mech. Support Only 0.075 Ø 0.000 0.178 0.404 0.628 1.644 1.890 1.769 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 0.121 0.121 0.122 0.123 0.123 1.769 1.771 0.178 0.404 0.628 1.644 |
Similar Part No. - TGC4702-FC_15 |
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Similar Description - TGC4702-FC_15 |
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