TGL2203

Ka-Band 1 W VPIN Limiter

Preliminary Datasheet: Rev - 06-17-14

- 4 of 6 -

Disclaimer: Subject to change without notice

© 2013 TriQuint

www.triquint.com

Assembly Drawing

Mechanical Information and Pad Description

Unit: millimeters

Thickness: 0.10

Die x, y size tolerance: ± 0.050

Chip edge to bond pad dimensions are shown to center of pad

Ground is backside of die

Pad Number

Symbol

Description

Pad Size

1

Input; matched to 50 Ω.

0.100 x 0.200

2

Output; matched to 50 Ω.

0.100 x 0.200

Notes:

1. RF input and output ports are not interchangeable.

IN

OUT

1

2

RF IN

RF OUT

0.000

0.322

0.524

0.723

1.150

1

2

0.322

0.524

0.723

0.000

1.150