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TGL2206-SM Datasheet(PDF) 6 Page - TriQuint Semiconductor |
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TGL2206-SM Datasheet(HTML) 6 Page - TriQuint Semiconductor |
6 / 11 page TGL2206-SM 2.0-5.5 GHz 100 Watt VPIN Limiter Datasheet: Rev - 05-14-14 - 6 of 11 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com Applications Information EVB Layout RF layer is 0.020” thick Rogers RO6202, εr= 2.94. Metal layers are 1-oz copper. Microstrip 50 Ω line width is 0.050”. The microstrip line taper at the connector interface is optimized for the Southwest Microwave end-launch connector 1092-02A-5. The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. |
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