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5

Product

Data Sheet

Chip Assembly and Bonding Diagram

Reflow process assembly notes:

•= AuSn (80/20) solder with limited exposure to temperatures at or above 300ΓC

•= alloy station or conveyor furnace with reducing atmosphere

•= no fluxes should be utilized

•= coefficient of thermal expansion matching is critical for long-term reliability

•= storage in dry nitrogen atmosphere

Component placement and adhesive attachment assembly notes:

•= vacuum pencils and/or vacuum collets preferred method of pick up

•= avoidance of air bridges during placement

•= force impact critical during auto placement

•= organic attachment can be used in low-power applications

•= curing should be done in a convection oven; proper exhaust is a safety concern

•= microwave or radiant curing should not be used because of differential heating

•= coefficient of thermal expansion matching is critical

Interconnect process assembly notes:

•= thermosonic ball bonding is the preferred interconnect technique

•= force, time, and ultrasonics are critical parameters

•= aluminum wire should not be used

•= discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire

•= maximum stage temperature: 200ΓC

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

Recommend 500

Ω

Ω

Ω

Ω

series resistance

on the control lines

TGP1439