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TGS2352 Datasheet(PDF) 9 Page - TriQuint Semiconductor |
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TGS2352 Datasheet(HTML) 9 Page - TriQuint Semiconductor |
9 / 10 page TGS2352 DC – 12 GHz High Power SPDT Switch Product Compliance Information ESD Information ESD Rating: TBD Value: Passes ≥ TBD V min. Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 Solderability This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: • Lead Free • Halogen Free (Chlorine, Bromine) • Antimony Free • TBBP-A (C15H12Br402) Free • PFOS Free • SVHC Free ECCN US Department of Commerce EAR99 Assembly Notes Component placement and adhesive attachment assembly notes: • Vacuum pencils and/or vacuum collets are the preferred method of pick up. • Air bridges must be avoided during placement. • The force impact is critical during auto placement. • Organic attachment (i.e. epoxy) can be used in low-power applications. • Curing should be done in a convection oven; proper exhaust is a safety concern. Reflow process assembly notes: • Use AuSn (80/20) solder and limit exposure to temperatures above 300 °C to 3-4 minutes, maximum. • An alloy station or conveyor furnace with reducing atmosphere should be used. • Do not use any kind of flux. • Coefficient of thermal expansion matching is critical for long-term reliability. • Devices must be stored in a dry nitrogen atmosphere. Interconnect process assembly notes: • Thermosonic ball bonding is the preferred interconnect technique. • Force, time, and ultrasonics are critical parameters. • Aluminum wire should not be used. • Devices with small pad sizes should be bonded with 0.0007-inch wire. Preliminary Data Sheet: Rev A 06/20/11 - 9 of 10 - Disclaimer: Subject to change without notice © 2011 TriQuint Semiconductor, Inc. Connecting the Digital World to the Global Network® |
Similar Part No. - TGS2352_15 |
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Similar Description - TGS2352_15 |
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