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AN1762 Datasheet(PDF) 8 Page - STMicroelectronics

Part # AN1762
Description  APPLICATION NOTE
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN1762 Datasheet(HTML) 8 Page - STMicroelectronics

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AN1762 APPLICATION NOTE
8/53
Figure 7. Typical Application and Layout suggestions.
High current GND tracks (i.e. the tracks connected to the sensing resistors) must be connected directly to the
negative terminal of the bulk capacitor. A good quality, high-frequency bypass capacitor is also required (typi-
cally a 100nF÷200nF ceramic would suffice), since electrolytic capacitors show a poor high frequency perfor-
mance. Both bulk electrolytic and high frequency bypass capacitors have to be connected with short tracks to
VSA, VSB and GND. On the L6205, L6206, L6207 GND pins are the Logic GND, since only the quiescent current
flows through them. Logic GND and Power GND should be connected together in a
single point, the bulk ca-
pacitor, to keep noise in the Power GND from affecting Logic GND. Specific care should be paid layouting the
path from the
SENSE pins through the sensing resistors to the negative terminal of the bulk capacitor (Power
Ground). These tracks must be as short as possible in order to minimize parasitic inductances that can cause
dangerous voltage spikes on
SENSE and OUT pins (see the Voltage Ratings and Operating Range section);
for the same reason the capacitors on VSA, VSB and GND should be very close to the GND and supply pins.
Refer to the Sensing Resistors section for information on selecting the sense resistors. Traces that connect to
VSA, VSB, SENSEA, SENSEB, and the four OUT pins must be designed with adequate width, since high currents
are flowing through these traces, and layer changes should be avoided. Should a layer change prove neces-
sary, multiple and large via holes have to be used. A wide GND copper area can be used to improve power
dissipation for the device.
Figure 8 shows two typical situations that must be avoided. An important consideration about the location of the
bulk capacitors is the ability to absorb the inductive energy from the load, without allowing the supply voltage to
exceed the maximum rating. The diode shown in Figure 8 prevents the recirculation current from reaching the
capacitors and will result in a high voltage on the IC pins that can destroy the device. Having a switch or a power
connection that can disconnect the capacitors from the IC, while there is still current in the motor, will also result
in a high voltage transient since there is no capacitance to absorb the recirculation current.
+
-
VS = 8 ÷ 52 V
GND
GND
GND
GND
SENSEA
SENSEB
VSA
VSB
VBOOT
CP
OUT1B OUT2B
OUT1A OUT2A
D1
D2
R1
RS1
RS2
C3
C4
C1
C2
L6205, L6206, L6207
Motors or
other loads
Logic
GND


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