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FEATURES：

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Available in Lead Free Version

Maximum Ratings @Ta=25

℃ unless otherwise specified

Characteristic

Symbol

Value

Unit

Forward Voltage (Note 2)

0.9

V

Power Dissipation(Note 1)

350

mW

Thermal Resistance, Junction to Ambient Air

357

/

℃

W

Operating and Storage Temperature Range

-65 to +150

℃

Notes: 1. Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm

2. Short duration test pulse used to minimize self-heating effect.

SOD-123

BZT52C2V4-43

RoHS

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E-mail:wej@yongerjia.com

WEJ ELECTRONIC CO.,LTD