TQP4M9071

High Linearity 6-Bit, 31.5 dB Digital Step Attenuator

Package Marking and Dimensions

GND/THERMAL PAD

.10 C

.08 C

SEATING PLANE

24X

4.000

4.000

2.70±0.05

Exp. DAP

24X 0.40±0.05

2.70±0.05

Exp. DAP

.850±0.050

C

24X 0.25±0.05

24X 0.50 Pitch

Pin #1 IDENTIFIER

CHAMFER 0.300 x 45°

TERMINAL #1

IDENTIFIER

5

6

6

4

5

R.075

2.50 Ref.

.203 Ref.

0.000

0.050

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally enhanced

plastic very thin fine pitch quad flat no lead package (QFN).

3. Dimension and tolerance formats conform to ASME Y14.4M-1994.

4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.

5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins.

6. Package body length/width does not include plastic flash protrusion across mold parting line.

PCB Mounting Pattern

Notes:

1. All dimensions are in millimeters. Angles are in degrees.

2. Use 1 oz. copper minimum for top and bottom layer metal.

3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We

recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).

4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.

4M9071

YYWW

AaXXXX

Package Marking

Product Identifier: 4M9071

Date Code: YYWW

Assembly Code: AaXXXX

Datasheet: Rev M 08-15-14

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Disclaimer: Subject to change without notice

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