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TQP4M9071-PCB_IF Datasheet(PDF) 10 Page - TriQuint Semiconductor |
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TQP4M9071-PCB_IF Datasheet(HTML) 10 Page - TriQuint Semiconductor |
10 / 11 page TQP4M9071 High Linearity 6-Bit, 31.5 dB Digital Step Attenuator Package Marking and Dimensions GND/THERMAL PAD .10 C .08 C SEATING PLANE 24X 4.000 4.000 2.70±0.05 Exp. DAP 24X 0.40±0.05 2.70±0.05 Exp. DAP .850±0.050 C 24X 0.25±0.05 24X 0.50 Pitch Pin #1 IDENTIFIER CHAMFER 0.300 x 45° TERMINAL #1 IDENTIFIER 5 6 6 4 5 R.075 2.50 Ref. .203 Ref. 0.000 0.050 Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally enhanced plastic very thin fine pitch quad flat no lead package (QFN). 3. Dimension and tolerance formats conform to ASME Y14.4M-1994. 4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 5. Co-planarity applies to the exposed ground/thermal pad as well as the contact pins. 6. Package body length/width does not include plastic flash protrusion across mold parting line. PCB Mounting Pattern Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. 3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”). 4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 4M9071 YYWW AaXXXX Package Marking Product Identifier: 4M9071 Date Code: YYWW Assembly Code: AaXXXX Datasheet: Rev M 08-15-14 - 10 of 11 - Disclaimer: Subject to change without notice © 2014 TriQuint www.triquint.com |
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