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MAMX-011009 Datasheet(PDF) 3 Page - M/A-COM Technology Solutions, Inc.

Part # MAMX-011009
Description  Sub-Harmonic Pumped Mixer
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MAMX-011009 Datasheet(HTML) 3 Page - M/A-COM Technology Solutions, Inc.

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Sub-Harmonic Pumped Mixer
14 - 32 GHz
Rev. V1
MAMX-011009
3
3
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
3
Application Schematic
Parts List
Part
Value
Case Style
R1 - R3
0 Ω
0201
PCB Layout
PCB Footprint
Application Information
The MAMX-011009 is designed to be economical
and easy to use. By employing a sub-harmonic
topology, the user only has to deal with one high
frequency port (RF). This simplifies system design,
lowers cost, and combined with an ultra-small
plastic package delivers a superior system solution.
The MAMX-011009 design allows bi-direction
frequency conversion (IF to RF or RF to IF). The
conversion loss, isolation, and linearity are similar
either way.
For proper up or down frequency mixing the
MAMX-011009 must be driven with sufficient power
to activate the mixing diodes, typically 14 dBm or
higher.
We
highly
recommend
M/A-COM
Technology Solutions MAAM-011101, which has
been engineered to match the LO requirements of
the MAMX-011009.
Grounding
The printed circuit board (PCB) layout is simple for
the MAMX-011009 since no external components
are needed. The LO port is internally DC blocked;
DC voltages up to 20 V are acceptable. However,
proper grounding must be used for operation. It is
recommended that the total common ground
inductance not exceed 0.03 nH. This is equivalent
to placing a least four 8-mil (200 μm) diameter vias
under the device, assuming an 8-mil (200 μm) thick
RF layer to ground. More ground vias are recom-
mended if possible.
Up Conversion Summary
0
10
20
30
40
0
20
40
60
80
14
18
22
26
30
Conversion Loss
Input IP3
IF to RF Isolation
2xLO to RF Isolation
3xLO to RF Isolation
RF Frequency (GHz)


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