TQP7M9104

2W High Linearity Amplifier

Data Sheet: Rev H 09/24/12

- 8 of 13-

Disclaimer: Subject to change without notice

© 2012 TriQuint Semiconductor, Inc.

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Application Circuit 2110-2170 MHz (TQP7M9104-PCB2140)

C11

C10

R2

C9

C1

C7

C15

C3

U1

C17

C13

C14

1

2

3

4

5

6

GND/NC

18

17

16

15

14

13

RFout

RFout

RFout

GND/NC

Iref

Vbias

GND/NC

GND/NC

RFin

RFin

GND/NC

U1

C10

22 pF

R2

51



J2

RF

Input

C9

2.4 pF

C8

1.5 pF

C11

0



J3

RF

Output

C2

2.7 pF

C3

100 pF

C7

10 uF

6032

C15

22 pF

L1

18 nH

0805

B1

0



C1

100 pF

C17

1000 pF

L3

0



R1

120 nH

0603

C13

0.1 uF

R7

110



C14

100 pF

L4

0



R3

0



R6

220



Vcc

+5V

D3

SM05T1G

Bill of Material

Ref Des

Value

Description

Manuf.

Part Number

U1

n/a

2W High Linearity Amplifier

TriQuint

TQP7M9104

n/a

n/a

Printed Circuit Board

TriQuint

1078282

D3

n/a

Zener, dual, SOT-23

various

C8

1.5 pF

Capacitor, Chip, 0603, ±0.05pF, 50V, Accu-P

AVX

06035J1R5ABSTR

C9

2.4 pF

Capacitor, Chip, 0603, ±0.05pF, 50V, Accu-P

AVX

06035J2R4ABSTR

C2

2.7 pF

Capacitor, Chip, 0603, ±0.05pF, 50V, Accu-P

AVX

06035J2R7ABSTR

B1, L3, L4, R3, C11

0 Ω

Resistor, Chip, 0603, 5%, 1/16W

various

C10, C15

22 pF

Capacitor, Chip, 0603, 5%, 50V, NPO/COG

various

C1, C14, C3

100 pF

Capacitor, Chip, 0603, 5%, 50V, NPO/COG

various

L1

18 nH

Inductor, 1008, 5%, Ceramic

Coilcraft

1008HQ-18NXJL

C17

1000 pF

Capacitor, Chip, 0603, 10%, 50V, NPO/COG

various

C13

0.1 uF

Capacitor, Chip, 0603, 10%, 50V, X5R

various

C7

10 uF

Capacitor , Tantalum, 6032, 20 %, 50V

various

R2

51

Ω

Resistor, Chip, 0603, 5%, 1/16W

various

R6

220

Ω

Resistor, Chip, 0603, 1%, 1/16W

various

R7

110

Ω

Resistor, Chip, 0603, 1%, 1/16W

various

R1

120 nH

Inductor, 0603, 5%

Toko

LL1608-FSR12J

R8, R4, C12, C4, D3

n/a

Do Not Place

Notes:

1. See PC Board Layout under Application Information section for more information.

2. Components shown on the silkscreen but not on the schematic are not used.

3. 0

Ω resistors may be replaced with copper trace in the target application layout.

4. Iref can be used as device power down current by placing R7 at location R8.

5. The recommended component values are dependent upon the frequency of operation.

6. All components are of 0603 size unless stated on the schematic.

7. R1 is critical for device linearity performance.

8. Critical component placement locations:

Distance between center of C8 and U1 device package is 50 mil (5.5° at 2140MHz)

Distance between center of C2 and U1 device package is 113 mil (12.4° at 2140MHz)

Distance between center of C9 and U1 device package is 275 mil (30.3° at 2140MHz)