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UPD4712DGT Datasheet(PDF) 11 Page - NEC |
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UPD4712DGT Datasheet(HTML) 11 Page - NEC |
11 / 12 page µPD4712C/4712D 11 Soldering Condition Package peak temperature: 235 ˚C, Time: 3 0 seconds MAX. (210 ˚C MIN.), Number of times: 2, Number of days: not limited* Package peak temperature: 215 ˚C, Time: 40 seconds MAX. (200 ˚C MIN.), Number of times: 2, Number of days: not limited* Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX., Number of times: 1, Number of days: not limited* Pin temperature: 300 ˚C MAX. (lead temperature), Time: 3 seconds MAX. (per lead pin), Number of days: not limited* RECOMMENDED SOLDERING CONDITIONS Soldering the µPD4712C and 4712D under the conditions listed in the table below is recommended. For soldering methods and conditions other than those recommended, consult NEC. Surface mount type For the details of the recommended soldering conditions of the surface mount type, refer to Information document “Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00) µPD4712CGT, 4712DGT Recommended Condition Symbol IR35-00-2 VP15-00-2 WS60-00-1 Soldering Method Infrared reflow VPS Wave soldering Pin partial heating Caution Do not use two or more soldering methods in combination (except the pin partial heating method). Throught-hole type µPD4712CCY, 4712DCY Soldering Method Soldering Conditions Wave soldering Soldering bath temperature: 260 ˚C MAX., Time: 10 seconds MAX. REFERENCE DOCUMENTS “NEC Semiconductor Device Reliability/Quality Control System” (IEI-1212) “Quality Grade on NEC Semiconductor Devices” (IEI-1209) “Semiconductor Device Mounting Technology Manual” (C10535EJ7V0IF00) * The number of days the device can be stored at 25 ˚C, 65 % RH MAX. after the dry pack has been opened. |
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