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AN533 Datasheet(PDF) 10 Page - STMicroelectronics |
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AN533 Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 22 page Through-hole packages AN533 10/22 There are six basic rules to bear in mind: 1. Never clamp the plastic package (Figure 6). Figure 6. Clamping the lead not the package 2. Clamp the leads firmly between the plastic package and the bend / cut point (Figure 7). Figure 7. Clamping the lead between the package and the bend / cut point 3. Bend the leads at least 3 mm from the plastic package (Figure 8). Figure 8. Bending the lead at least 3 mm from the plastic package Plastic package Spaced Clamp mechanism Clamp mechanism Lead forming or cutting mechanism ✘ ✘ ✓ ✓ Incorrect Correct 3 mm Correct Incorrect |
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