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AN533 Datasheet(PDF) 10 Page - STMicroelectronics

Part # AN533
Description  The behavior of a semiconductor device depends
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN533 Datasheet(HTML) 10 Page - STMicroelectronics

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Through-hole packages
AN533
10/22
There are six basic rules to bear in mind:
1.
Never clamp the plastic package (Figure 6).
Figure 6.
Clamping the lead not the package
2.
Clamp the leads firmly between the plastic package and the bend / cut point (Figure 7).
Figure 7.
Clamping the lead between the package and the bend / cut point
3.
Bend the leads at least 3 mm from the plastic package (Figure 8).
Figure 8.
Bending the lead at least 3 mm from the plastic package
Plastic package
Spaced
Clamp mechanism
Clamp mechanism
Lead forming or
cutting mechanism
Incorrect
Correct
3 mm
Correct
Incorrect


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