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LTC1626 Datasheet(PDF) 9 Page - Linear Technology |
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LTC1626 Datasheet(HTML) 9 Page - Linear Technology |
9 / 12 page 9 LTC1626 Thermal Considerations In a majority of applications, the LTC1626 does not dissipate much heat due to its high efficiency. However, in applications where the switching regulator is running at high duty cycles or the part is in dropout with the switch turned on continuously (DC), some thermal analysis is required. The goal of the thermal analysis is to determine whether the power dissipated by the regulator exceeds the maximum junction temperature. The temperature rise is given by: TRISE = PD • θJA where PD is the power dissipated by the regulator and θJA is the thermal resistance from the junction of the die to the ambient temperature. The junction temperature is given by: TJ = TRISE + TAMBIENT As an example, consider the case when the LTC1626 is in dropout at an input voltage of 3V with a load current of 0.5A. From the Typical Performance Characteristics graph of Switch Resistance, the ON resistance of the P-channel switch is 0.45 Ω. Therefore, power dissipated by the part is: PD = I2 • RDS(ON) = 113mW The SO package junction-to-ambient thermal resistance θJAis110°C/W.Therefore,thejunctiontemperatureofthe APPLICATIONS INFORMATION regulator when it is operating in a 25 °C ambient tempera- ture is: TJ = (0.113 • 110) + 25 = 38°C Remembering that the above junction temperature is obtained from an RDS(ON) at 25°C, we might recalculate the junction temperature based on a higher RDS(ON) since it increases with temperature. However, we can safely assume that the actual junction temperature will not exceed the absolute maximum junction temperature of 125 °C. Board Layout Considerations When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC1626. These items are also illustrated graphically in the layout diagram of Figure 6. Check the following in your layout: 1. Are the signal and power grounds separated? The LTC1626 signal ground (Pin 11) must return to the (–) plate of COUT. The power ground (Pin 12) returns to the anode of the Schottky diode and the (–) plate of CIN. 2. Does the (+) plate of CIN connect to the power VIN (Pins 1, 13) as close as possible? This capacitor provides the AC current to the internal P-channel MOSFET and its driver. Figure 6. LTC1626 Layout Diagram (See Board Layout Checklist) + 1 2 13 PWR VIN CIN COUT RSENSE VOUT 1626 F06 VIN BOLD LINES INDICATE HIGH CURRENT PATHS D1 0.1 µF L R1 1k CT 1000pF 3900pF R2 VIN SW LTC1626 PWR VIN PGND SGND SHDN VFB SENSE+ SHUTDOWN LBO LBI CT ITH SENSE– 3 4 5 6 7 14 12 11 10 9 8 |
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Similar Description - LTC1626 |
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