BAS70-00 to BAS70-06

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Vishay Semiconductors

Rev. 2.0, 25-Feb-13

2

Document Number: 85702

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Note

Thickness:

Fiberglass 1.5 mm (0.059")

Copper leads 0.3 mm (0.012")

PACKAGE DIMENSIONS in millimeters (inches): SOT-23

PARAMETER

TEST CONDITION

SYMBOL

MIN.

TYP.

MAX.

UNIT

Reserve beakdown voltage

70

V

Leakage current

20

100

nA

Forward voltage

410

mV

1000

mV

Diode capacitance

1.5

2

pF

Reserve recovery time

5ns

17451

15 (0.59)

12 (0.47)

0.8 (0.03)

5 (0.2)

7.5 (0.3)

3 (0.12)

1 (0.4)

1 (0.4)

2 (0.8)

2 (0.8)

1.5 (0.06)

5.1 (0.2)

Foot print recommendation:

Rev. 8 - Date: 23.Sept.2009

17418

Document no.: 6.541-5014.01-4

0.9 (0.035)

1 (0.039)

0.9 (0.035)

1 (0.039)

0.45 (0.018)

0.35 (0.014)

2.8 (0.110)

3.1 (0.122)

0.45 (0.018)

0.35 (0.014)

0.45 (0.018)

0.35 (0.014)

2.35 (0.093)

2.6 (0.102)

0.95 (0.037)

0.95 (0.037)

0.7 (0.028)

0.3 (0.012)

0.5 (0.020)

0.550 ref. (0.022 ref.)