11

LT1302/LT1302-5

1ms/DIV

1302 F08b

100mV/DIV

AC COUPLED

LT1302 into Current Mode Regardless of Load. Audio

Frequency Component Eliminated

525mA

25mA

INDUCTOR

CURRENT

1A/DIV

connected to the pin will cause erratic operation. If oper-

ating the device in Burst Mode, let the pin float. Keep high

dV/dt signals away from the pin.

Figure 8c details efficiency with and without the addition of

R1. Burst Mode operation keeps efficiency high at light

R1 added because the LT1302 cannot transition into Burst

Mode.

Layout

The high speed, high current switching associated with

the LT1302 mandates careful attention to layout. Follow

the suggested component placement in Figure 9 for proper

operation. High current functions are separated by the

package from sensitive control functions. Feedback resis-

tors R1 and R2 should be close to the feedback pin (pin4).

Noise can easily be coupled into this pin if care is not taken.

A small capacitor (100pF to 200pF) from FB to ground

provides a high frequency bypass. If the LT1302 is oper-

ated off a three-cell or higher input, R3 (2

Ω to 10Ω) in

from noise spikes on the input supply. Do not put in R3 if

the device must operate from a 2V input, as input current

2V. The 0.1

µF ceramic bypass capacitor C3 (use X7R, not

Z5U) should be mounted as close as possible to the

package. When R3 is used, C3 should be a 1

µF tantalum

unit. Grounding should be segregated as illustrated. C3’s

ground trace should not carry switch current. Run a

Efficiency at Moderate Load, Decreases at Light Load

OUTPUT CURRENT (mA)

1

90

80

70

60

50

40

30

10

100

1000

1302 F08c

Figure 9. Suggested Component Placement for LT1302

ally reaches audio frequencies, but at a much lighter load

current combinations, some residual bursting may occur

at frequencies out of the audio band.

1302 F09

4

3

2

1

8

7

6

5

LT1302

C3

R3

2

Ω

D1

C2

C1

L1

+

200pF

R1

R2

SHUTDOWN

GND (BATTERY AND LOAD RETURN)